DTS utilizes a PCB fabrication strategy that incorporates a network of global
manufacturing operations in all world areas. DTS fabrication partners offer a full
range of PCB manufacturing capabilities, materials and a virtually unlimited
amount of capacity. Instituting a network of fabrication facilities allows DTS the
flexibility to access state-of-the-art manufacturing processes for high complexity
products along with offering substantial cost reductions for standard products and
production reorders. By maintaining a global network of fabrication partners,
capabilities, material availability, cycle-time, communications, cost savings and
capacity are always optimized for the customer.
PCB FAB Capabilities
| Maximum Layers |
54+ |
| Impedance Control |
+/-10% (5% available) |
| Maximum Board Thickness |
280 Mils |
| Sequential Lamination |
Dual, Triple, Quad |
| Maximum Drill Aspect |
30:1 |
| Minimum Line Width |
3 mils |
| Minimum Line Spacing |
3 mils |
| Minimum Device Pitch |
0.35mm |
| Minimum Drill Diameter |
4 -6 mils w/seqential lam (8 mil standard) |
| Stub Drilling |
Multiple Depth |
| Filled Vias |
4000+ (Ni/Au Plated) |
| Nickel Plating |
100-350 microinches |
| Gold Plating |
10-80 microinches |
| Selective Plating |
|
| Blind & Buried Via Technology |
|
| Mixed Dielectric Fabrication |
|
PCB Materials
FR4 (Standard and Enhanced)
Nelco 4000-13
Nelco 4000-13 (Si)
Rogers 4003/4350
Gore Speed Board
Polyimide P95/P25
Arlon 85N
BT Resin G200
Isola IS420
