Dynamic Test Solutions

PCB Fabrication

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PCB Fabrication

DTS utilizes the PCB fabrication strategy that incorporates a network of global manufacturing operations in all world areas. DTS fabrication partners offer a full range of PCB manufacturing capabilities, materials and virtually unlimited amount of capacity. Instituting a network of fabrication facilities allows DTS the fexability to access state-of-the-art manufacturing processes for high complexity products along with offering substantial cost reductions for standard products and production reorders. By maintaining a global network of fabrication partners, capabilities, material availablity, cycle-time, communications, cost savings and capacity are always optimized for the customer.

Detail Sheet

PCB FAB CAPABILITIES

Maximum Layers 54+
Impedance Control +/- 10% (5% available)
Maximum Board Thickness 280 Mils
Sequential Lamination Dual, Triple, Quad
Maximum Drill Aspect 30:1
Minimum Line Width 3 mils
Minimum Line Spacing 3 mils
Minimum Device Pitch 0.35mm
Minimum Drill Diameter 4-6 mils w/sequential lam (8 mil standard)
Stub Drilling Multiple Depth
Filled Vias 4000+ (Ni/Au Plated)
Nickel Plating 100-350 microinches
Gold Plating 10-80 microinches

Selective Plating
Blind & Buried Via Technology
Mixed Dielectric Fabrication

PCB MATERIALS

FR4 (Standard and Enhanced)
Nelco 4000-13
Nelco 4000-13 (Si)
Getek
Rogers 4003/4350
Gore Speed Board
Polyimide P95/P25
Arlon 85N
BT Resin G200
Isola IS420
Cyanate Ester



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